Vacuum metallization
I-vacuum metallization, ekwabizwa ngokuba yi-physical vapour deposition (PVD), yinkqubo yokwambathisa entsonkothileyo enika iipropathi zetsimbi kwiisubstrates ezingezizo ezentsimbi ngokufaka iifilim ezibhityileyo zentsimbi. Inkqubo ibandakanya ukufuduka komthombo wesinyithi ngaphakathi kwegumbi lokufunxa, kunye nentsimbi ekhutshiweyo ijiya kumphezulu we-substrate ukuze yenze i-coating yentsimbi ebhityileyo, efanayo.
Inkqubo ye-vacuum metallization
1.Ukulungiselela:I-substrate ihlanjululwa ngokucokisekileyo kunye nokulungiswa kwendawo ukuze kuqinisekiswe ukunamathela ngokufanelekileyo kunye nokufana kwengubo.
2.Igumbi lokufunxa:I-substrate ifakwe kwigumbi lokucoca kwaye inkqubo ye-metallization iqhutyelwa phantsi kweemeko ezilawulwa ngokungqongqo. Igumbi likhutshiwe ukuze lidale indawo ephezulu ye-vacuum, ukuphelisa umoya kunye nokungcola.
3.Ukuguquka kwesinyithi:Imithombo yesinyithi ifudunyezwa kwigumbi le-vacuum, ibangela ukuba ikhuphe okanye i-sublimate kwii-athomu zetsimbi okanye iimolekyuli, njl.
4.Ukubekwa:Xa umphunga wesinyithi udibanisa i-substrate, idibanisa kwaye yenza ifilimu yesinyithi. Inkqubo yokubeka iyaqhubeka de kube ubukhulu obufunwayo kunye nokugubungela kufezekisiwe, okubangela ukugquma okufanayo kunye neempawu ezibalaseleyo ze-optical and mechanical properties.
Isicelo seshishini
| • Ushishino lweemoto | •Ii-elektroniki zabathengi |
| •Ishishini lokupakisha | •izicelo zokuhombisa |
| •Ifashoni kunye nezixhobo | •Ukupakishwa kweCosmetic |
Sibonelela ngezinto ezisetyenziswa kwi-vacuum metallization consumables, ezifana ne-tungsten evaporation filament (i-tungsten coil), isikhephe se-evaporation, i-high-purity wire aluminium, njl.
Ixesha lokuposa: Apr-25-2024